variables: 737088

This table contains all the variables of all the datasets we have at Our World In Data. Note that this includes only the information about the variables like name and default display settings, not the data itself.

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This data as json

id name unit description createdAt updatedAt code coverage timespan datasetId sourceId shortUnit display columnOrder originalMetadata grapherConfigAdmin shortName catalogPath dimensions schemaVersion processingLevel processingLog titlePublic titleVariant attributionShort attribution descriptionShort descriptionFromProducer descriptionKey descriptionProcessing licenses license grapherConfigETL type sort dataChecksum metadataChecksum
737088 Assembly, testing and packaging % The completion of the fabrication process yields a finished wafer housing numerous chips in a grid pattern. The subsequent stage is Assembly, which involves testing and packaging. The wafer undergoes division into individual chips or 'dies.' Each chip is mounted on a frame, wired to facilitate connection with external devices, and housed within a protective case. This stage results in the familiar image of a rectangular, dark grey chip with metal pins around the periphery. The chip also undergoes testing to confirm its operational capacity. Historically, Assembly, Test, and Packaging (ATP) was considered a lower value stage. However, with the exponential rise in transistor densities within logic chips, packaging has progressively become a key determinant of chip performance. 2023-07-07 12:01:27 2024-07-08 17:49:16     2021-2021 6118 29581 % 
{
    "unit": "%",
    "shortUnit": "%"
}
 0     assembly__testing__and_packaging__atp grapher/artificial_intelligence/2023-07-07/semiconductors_cset/semiconductors_cset#assembly__testing__and_packaging__atp   1                 
[]
         int 
[]
 7ca65a5ea9f158d48885a18083ce88fc bb36b93d961be705d315ab4198d9066f

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